In the SMT surface mount process, the necessary testing steps include the following key steps:

1. Incoming Inspection (IQC)

Purpose: To ensure the quality of components and PCB boards.

Content: Check size, appearance, electrical performance, etc.

2. Solder Paste Printing Inspection (SPI)

Purpose: To ensure the quality of solder paste printing.

Content: Check the thickness, position, and shape of the solder paste.

3. Inspection after SMT

Purpose: To ensure accurate placement of electronic components.

Content: Check position, direction, and polarity.

4. Inspection after reflow soldering

Purpose: To ensure welding quality.

Content: Check the quality of solder joints and the condition of components.

5. Automatic Optical Inspection (AOI)

Purpose: To automatically detect welding and mounting defects.

Content: Check the solder joints, component positions, and appearance.

6. X-ray inspection (AXI)

Purpose: To detect hidden welding defects.

Content: Check the solder joints of BGA, QFN and other components.

7. Online Testing (ICT)

Purpose: To test electrical performance.

Content: Testing short circuits, open circuits, component values, etc.

8. Functional Testing (FCT)

Purpose: To verify the functionality of the circuit board.

Content: Simulate actual working conditions and test overall functionality.

9. Aging test

Purpose: To screen for early faults.

Content: Prolonged power on exposes potential defects.

10. Final appearance inspection

Purpose: To ensure that the product appearance meets the requirements.

Content: Check cleanliness, labels, appearance damage, etc.

11. Pre packaging inspection

Purpose: To ensure packaging quality.

Content: Check packaging integrity and labeling.

summarize

These testing steps ensure the quality and reliability of SMT surface mount products, covering the entire process from raw materials to finished products